JPH0648871Y2 - コールドプレート構造 - Google Patents

コールドプレート構造

Info

Publication number
JPH0648871Y2
JPH0648871Y2 JP1989147034U JP14703489U JPH0648871Y2 JP H0648871 Y2 JPH0648871 Y2 JP H0648871Y2 JP 1989147034 U JP1989147034 U JP 1989147034U JP 14703489 U JP14703489 U JP 14703489U JP H0648871 Y2 JPH0648871 Y2 JP H0648871Y2
Authority
JP
Japan
Prior art keywords
cooling
cold plate
flow path
cooling liquid
heating element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989147034U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0385653U (en]
Inventor
伸嘉 山岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1989147034U priority Critical patent/JPH0648871Y2/ja
Publication of JPH0385653U publication Critical patent/JPH0385653U/ja
Application granted granted Critical
Publication of JPH0648871Y2 publication Critical patent/JPH0648871Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1989147034U 1989-12-22 1989-12-22 コールドプレート構造 Expired - Lifetime JPH0648871Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989147034U JPH0648871Y2 (ja) 1989-12-22 1989-12-22 コールドプレート構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989147034U JPH0648871Y2 (ja) 1989-12-22 1989-12-22 コールドプレート構造

Publications (2)

Publication Number Publication Date
JPH0385653U JPH0385653U (en]) 1991-08-29
JPH0648871Y2 true JPH0648871Y2 (ja) 1994-12-12

Family

ID=31693567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989147034U Expired - Lifetime JPH0648871Y2 (ja) 1989-12-22 1989-12-22 コールドプレート構造

Country Status (1)

Country Link
JP (1) JPH0648871Y2 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4635595B2 (ja) * 2004-12-16 2011-02-23 ダイキン工業株式会社 熱交換システム

Also Published As

Publication number Publication date
JPH0385653U (en]) 1991-08-29

Similar Documents

Publication Publication Date Title
JP2020073845A (ja) エレクトロニクス機器を冷却する受動的及び能動的な流れ制御を伴うモジュール式の噴流衝当アセンブリ
US8391008B2 (en) Power electronics modules and power electronics module assemblies
JP2500757B2 (ja) 集積回路の冷却構造
US20050180104A1 (en) Cooling unit and flow distributing element for use in such unit
JPH05109954A (ja) 集積回路パツケージの冷却構造
JP2008501926A (ja) 熱交換器及び冷却方法
CN104859305A (zh) 液体喷出头、记录设备和液体喷出头所用的散热方法
US20250048589A1 (en) Cooling apparatus for power module
JP2001127478A (ja) 熱伝導冷却板装置
EP2559063A1 (en) A flow distributor
JPH05304234A (ja) 集積回路の冷却構造
JP2019169614A (ja) 冷却装置
JPH0648871Y2 (ja) コールドプレート構造
JPH06120387A (ja) ヒートシンク
JPH04152659A (ja) マルチチツプモジュールの冷却方法及び装置
CN201994284U (zh) 一种散热装置及功率模块
JPH0311546B2 (en])
US20250107038A1 (en) Jet impingement cooling systems and related methods of cooling high heat flux devices
JPH0732221B2 (ja) 集積回路の冷却構造
JPH08213783A (ja) 電気自動車用冷却装置
JP4702219B2 (ja) 冷却装置
JPH0567712A (ja) 集積回路の冷却機構
US20250203762A1 (en) Semiconductor device
JPH0732222B2 (ja) 集積回路の冷却構造
JPH01270297A (ja) 伝導冷却モジュール